-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Ralf Wagenfuehr on Developing Rehm Thermal Systems' RDS Semico Oven
May 1, 2019 | Barry Matties, I-Connect007Estimated reading time: 8 minutes
Wagenfuehr: The energy consumption, as well as the stability in the process, has much less downtime and fewer failure rates on the system.
Matties: What about the overall cycle time? Is the RDS Semico producing at a higher throughput?
Wagenfuehr: As you are choosing models, we are flexible. We have models three to five with a 2,400-mm process chamber up to a 3,850-mm process chamber. We can fit it to the requirements of the customer since we have several solutions, not only one machine. It depends on the customer’s cycle times, but we can reach speeds of 1,200–1,300 mm per minute, which is quite a high cycle time.
Matties: I see you have online monitoring for this as well. Can you tell us about that?
Wagenfuehr: We have several online monitoring processes. First, we have the internal chamber temperature and the flow of the dedicated zones that adjust as well as vibrations. That is the main feature that makes for a safe process. Of course, the temperature depends on the standard in combination with SECS/GEM or other MES interfaces.
Second, we also have the Rehm Open Interface (ROI). If you don’t use SECS/GEM, we have the ROI to give all of the data you want so that you can adapt to this. Any data point created in the RDS Semico can bring it to your MES system. That also makes the software very flexible for the future. All of the data points that are built in—chain speed, vibration, temperature, flow speed, nitrogen value—and you can use every value as you want in your MES, tailor-made.
Then, the adoption of your system in the factory is very easy. That is the flexibility we created, and we have it in other systems. As we’re coming from automotive, there have been Industry 4.0 MES systems from ‘90–’95. Industry 4.0 comes from a German perspective a very long time ago, which is why we are also a driving country for that, automotive, and traceability. This is nothing different. Now, the new software integrations make it more flexible for how the customer can extract or get the information.
Matties: That’s a great overview. What’s the expectation in terms of market share for the RDS Semico? What’s the process to evaluate and make a decision to purchase this machine?
Wagenfuehr: We understand that there is a big market in Taiwan and Korea. We established our own offices in the last three years to match these requirements whenever Taiwan is the biggest semiconductor manufacturing location for the packaging process. We want to be there and grab that market share. That is our target. If we get 20% within the next 2–3 years, that would be nice.
The semiconductor industry often takes a little bit of time, but you need to be verified by the end user. We already have good customers. We put our equipment inside, and once it’s recognized by the end customer and verified, the next step to get the next customer is easy. Going by big customers in Taiwan, they also have large facilities in Korea, so we are working in parallel with our team in Taiwan, Korea, and China right now. Again, once you recognize the market, it’s easy to take the next step. Our target for this year is to get end customer verifications from the recognized chip manufacturers.
Matties: How long have you been here in China, Ralf?
Wagenfuehr: 15 years.
Matties: And there have been lots of changes in China in 15 years.
Wagenfuehr: Yes, it’s an interesting time, and the industry is changing. In China, we’re seeing automotive and semiconductors in the last three years as a rising market; it will become very big, and we are ready with proven solutions. We’ve taken the right steps to prepare for this trend. We’re not the fastest, but we are a German company, and everything we’re doing is technology proven, which is important to us. We have certificates from recognized universities and technical verification centers, such as Fraunhofer. Our systems are internationally proven to be used in this industry, which takes time, but we are ready for the future.
Matties: Good. Well, I appreciate your time today. Thank you very much.
Wagenfuehr: Thank you.
Page 2 of 2Suggested Items
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.