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Infineon, Honda Enter Strategic Collaboration to Collaborate on Automotive Semiconductor Solutions
February 2, 2024 | InfineonEstimated reading time: Less than a minute
Infineon Technologies AG announced that Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration. Honda selects Infineon as semiconductor partner to align future product and technology roadmaps. The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies.
“Infineon’s system understanding, our broad product portfolio and outstanding quality have made us an appreciated partner to Japan’s automotive industry,” said Peter Schiefer, President of the Automotive Division at Infineon. “We are honored to be the semiconductor partner for a strategic collaboration with Honda. Intensifying a long-standing partnership even further is always a confirmation of the added value created and at the same time an expression of the trust in contributing to future successes.”
Infineon will support Honda with technologies to enable competitive and advanced vehicles. The technical support will focus on the area of power semiconductors, Advanced Driver Assistance Systems (ADAS), and E/E architectures, where both parties will collaborate on new architecture concepts.
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Infineon Expands Leading Market Position in Automotive Semiconductors
04/11/2024 | InfineonInfineon Technologies AG continued to expand its leading market position in automotive semiconductors in 2023. According to the latest research by TechInsights, the global automotive semiconductor market grew by 16.5 percent in 2023, reaching a new record size of US$69.2 billion.
Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
04/10/2024 | InfineonInfineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.
Infineon, HD Korea Shipbuilding & Offshore Engineering Jointly Develop Ship Electrification Technology
04/03/2024 | InfineonInfineon Technologies AG and HD Korea Shipbuilding & Offshore Engineering Co. Ltd. have signed a non-binding Memorandum of Understanding (MoU) as a first step towards jointly developing emerging applications for the electrification of marine engines and machinery using energy-efficient power semiconductor technology.
Infineon Sells Manufacturing Sites in Philippines and South Korea to ASE
02/26/2024 | InfineonInfineon Technologies AG and ASE Technology Holding Co., Ltd. announced that definitive agreements were signed under which Infineon will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE, a leading provider of independent semiconductor manufacturing services in assembly and test.
Infineon Presents Hybrid Time of Flight (hToF): Advanced Technology for Next-generation Smart Robots
01/31/2024 | InfineonIn collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon Technologies AG has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots.