-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
OSP and Selective Electroless Nickel for Mixed-Metal Finish PWBs and BGA Substrates
February 10, 2015 | Michael Carano, OM Group Electronic Chemicals, LLCEstimated reading time: 1 minute
The documentation relating to the requirements for alternative surface finishes have been well publicized at many industry forums. Pressure to eliminate lead in electronics assemblies is forcing fabricators and OEMs to reevaluate their surface finish and joint attachment procedures. Many of the requirements, in fact, are obvious. Regardless, the PWB fabrication industry needs to work closely with contract manufacturers and end users to fully appreciate the true impact of technology trends. These trends are significant and include:
- Surface mount continues to increase at the expense of through-hole with finer and finer features.
- The use of non-tin/lead coatings and surface finishes will increase. Surface finishes such as electroless nickel/immersion gold, OSP and immersion tin will be utilized.
- With political movements toward banning lead in all electronic assemblies gaining significant momentum, lead-free solder pastes and wave solder materials will be adopted.
- The need for more robust solderable finishes under extreme environmental conditions including corrosive atmospheres.
- The alternative surface finishes must perform through multiple thermal cycles with less active pastes and fluxes.
- The use of multiple metal finishes on the same bare board will place new emphasis on the compatibility of coating with each other, and the actual assembly module.
- Increased I/O demand and reduced lead pitch will require much tighter controls over the processes used to fabricate the bare board.
Editor’s Note: This article originally appeared in the February 2015 issue of The PCB Magazine
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.