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Autonomous Driving: Peters at Forefront of Technology

01/19/2024 | Peters
MID4automotive: This is a publicly funded research project in the field of microelectronics/automotive, where Peters is involved alongside numerous other electrical engineering companies and institutes.

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

01/17/2023 | Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).

Print, Recycle, Repeat: Scientists Demonstrate a Biodegradable Printed Circuit

09/16/2022 | University of California
According to the United Nations, less than a quarter of all U.S. electronic waste gets recycled. In 2021 alone, global e-waste surged at 57.4 million tons, and only 17.4 percent of that was recycled.

Print, Recycle, Repeat: Scientists Demonstrate a Biodegradable Printed Circuit

08/31/2022 | Berkeley Lab
According to the United Nations, less than a quarter of all U.S. electronic waste gets recycled. In 2021 alone, global e-waste surged at 57.4 million tons, and only 17.4% of that was recycled.

University of Illinois Researchers Create Low-cost High-Yield Plastic Microprocessors

06/28/2022 | University of Illinois
Supercomputers can crunch massive data sets and give us insights into the wonders of the universe. But a sub-penny microprocessor that flexes to fit on a beer bottle and tells you whether your brew is still cold? Creating that technology has been surprisingly more difficult to achieve.
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