-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
New IPC Report Details How PCB Makers Address Tech Trends
June 1, 2015 | IPCEstimated reading time: 2 minutes
PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.
Based on data collected from 158 companies worldwide, the 173-page PCB technology trends study presents the aggregate data segmented by application for five key segments: computers and telecommunications, consumer electronics, industrial and automotive electronics, medical electronics, and military and aerospace electronics.
The study covers such issues as: clock speed, heat dissipation, operation cycles, product life expectancy, environmental operating range, lamination cycles, board thickness, layer counts, line width and spacing, via diameters, aspect ratios, use of embedded technologies, surface-mount land dimensions, I/O pitch, test density, recyclable content, component size, and numbers of leads, solder joints and components per board area.
Among the many interesting findings, the study reports that nearly half of the responding PCB manufacturers for computer and telecommunications applications expect their highest clock speeds in 2019 to exceed 25 gigahertz. This segment had the highest clock speed predictions. The military and aerospace segment reported that heat dissipation is a design-limiting factor in half of their devices currently, which is the highest of the five applications studied, and they expect that percentage to rise in the next four years. More than one-third of responding companies in the military and aerospace segment are currently embedding passive components in their boards. Embedding of passive and active components is expected to increase substantially by 2019 for all five applications studied.
PCB Technology Trends 2014 is available free to companies that participated in the survey. Other companies may purchase the report by visiting IPC’s online store. The price for IPC members is $675 and $1,350 for nonmembers. For more information or to purchase the report, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,600 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.
TE Connectivity Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/09/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that TE Connectivity has finalized the purchase of a Pulsar solderability testing system.