FEATURED NEWS AND INFORMATION:
We search high and low to find the best news for you, our valuable readers…
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C)...
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
indie Semiconductor, Inc., an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable...
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
GlobalFoundries (GF) is furthering its commitment to sustainable operations and fighting climate change with the announcement of two new long-term...
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
ROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the...
AI Demand Drives Rapid Growth in QLC Enterprise SSD Shipments for 2024
North American customers are increasing their orders for storage products as energy efficiency becomes a key priority for AI inference servers. This,...
IDTechEx Report Unveils 3D Electronics Status and Opportunities
3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic...
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
April 23, 2024 | Intel
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
April 23, 2024 | indie Semiconductor
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
April 23, 2024 | GlobalFoundries
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
April 23, 2024 | ROHM
AI Demand Drives Rapid Growth in QLC Enterprise SSD Shipments for 2024
April 23, 2024 | TrendForce
IDTechEx Report Unveils 3D Electronics Status and Opportunities
April 22, 2024 | PRNewswire
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
April 22, 2024 | Altair
Aaron Woolf, Dylan Peterson Join SIA Team
April 22, 2024 | SIA
Intel Gaudi, Xeon and AI PC Accelerate Meta Llama 3 GenAI Workloads
April 22, 2024 | Intel Corporation
IDTechEx Examines the Opportunities for Wearables in Digital Health
April 19, 2024 | IDTechEx
Box Build Featuring:
- Thinking Inside the Box for a Change interview with Joe O’Neil
- A CM’s Perspective on Box Build Practices by Mike Konrad
- Determining the Value-add of a Box Build interview with Jonathan Schmitz
- The Connection between Wire Harness and Box Build interview with Christina Rutherford
- Do More, Get More by Nolan Johnson
The Growing Industry Featuring:
- The New Industry: Will the Growth Continue? with Shawn DuBravac and Tom Kastner
- Right Sizing ZLD and a Model for PCB Startups with Alex Stepinski
- TTM’s High Tech Expansion and Industry Innovation with Tom Edman
- USPAE to Springboard U.S. Technology Forward with Joe O’Neil
- Shane Whiteside Discussing PCB Landscape
Level Up Your Design Skills Featuring:
- IPC Design Competition: On Your Mark, Get Set, Go! with Patrick Crawford and Kris Moyer
- PCB Design Engineering Now ‘Official Occupation’, by Cory Blaylock
- What’s New in Design Education at IPC APEX EXPO? with Kelly Allen
- IPC Focuses on Education and Onboarding, with Carlos Plaza
- Time to Think Like an Engineer, with Filbert Arzola
- IPC's Vision for Empowering PCB Design Engineers, by Robert Erickson
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in