OUR COLUMNISTS


Marc Carter

Marc Carter, Aeromarc LLC

This is a series of columns or articles based on a course at Michigan Tech on PCB design, manufacturing, and assembly.

Latest Column: Better to Light a Candle: Chapter Nine—Growing Interest Around the Country


Barry Olney

Barry Olney, In-Circuit Design Pty. Ltd.

Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.

Latest Column: Beyond Design: Routing Strategies for High-Speed PCB Design


Team Sunstone Circuits

Team Sunstone Circuits, Sunstone Circuits

Team Sunstone Circuits will cover solutions to help your PCB projects succeed.

Latest Column: Connect the Dots: Design Tips for Layout


John Talbot

John Talbot, Tramonto Circuits

John focuses on flex and rigid-flex PCB and PCBA technologies, as well as various global business, technical, and market aspects.

Latest Column: Consider This: Let’s Talk About the Basics of Flex


Dana Korf

Dana Korf, Korf Consultancy LLC

Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.

Latest Column: Dana on Data: Reducing PCB Specification Interpretation Issues


Dennis Fritz

Dennis Fritz, Fritz Consulting

Dennis covers military and defense industry topics and applications.

Latest Column: Defense Speak Interpreted: Intel Is Now Making a ‘SHIP’


Patrick Crawford

Patrick Crawford, IPC

Patrick Crawford provides updates on IPC Design activities.

Latest Column: Design Circuit: Failures of Imagination—A Column of Caution


Vern Solberg

Vern Solberg, Consulting

This column will focus on technical issues related to PCB and Flex circuit design, etc.

 

Latest Column: Designers Notebook: Panel-level Semiconductor Package Design Challenges


John Watson

John Watson, Altium

John Watson covers a variety of tips that designers need to know.

Latest Column: Elementary, Mr. Watson: Density Feasibility Putting 10 Lbs in a 5-Lb Bag


Dominique Numakura

Dominique Numakura, DKN Research

Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.

Latest Column: EPTE Newsletter: The Printed Circuit Industry in China


Dugan Karnazes

Dugan Karnazes, Velocity Research

Dugan Karnazes is the founder and CEO of Velocity Research in Grand Rapids, Michigan.

Latest Column: Figure It Out: Field-Programmable Battery Array (Unsolved)


Tara Dunn

Tara Dunn, Averatek

When it comes to Flexible Interconnect circuits, Tara really knows what she is talking about!

Latest Column: Flex Talk: Communication Goes Both Ways


Joe Fjelstad

Joe Fjelstad, Verdant Electronics

As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.

Latest Column: Flexible Thinking: Thermal Management—Electronic Technology’s Rodney Dangerfield


IPC Education Foundation

IPC Education Foundation, IPC

Members from the IPC Education Foundation share updates on programs and activities.

Latest Column: Foundations of the Future: Inspirational Career Paths—Meet Tayler and Olivia


NCAB Team

NCAB Team, NCAB Group

Field application engineers from NCAB Group's technical team explore fresh PCB concepts.

Latest Column: Fresh PCB Concepts: Finding and Qualifying a Long-Term Partner


Mike Hill

Mike Hill, MIL-Q-Consulting LLC

Mike’s columns will help you better understand the requirements and how-to’s for MIL-PRF-31032 certification for PWB fabrication.

Latest Column: From The Hill: Pillars of Mil-Aero Technology and Revenue


Dan Beaulieu

Dan Beaulieu, DB Management

This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.

Latest Column: It’s Only Common Sense: Words of Wisdom From Bezos


Bob Wettermann

Bob Wettermann, BEST, Inc.

Bob Wettermann looks at the challenges in rework and repair, and provides strategies in addressing them.

Latest Column: Knocking Down the Bone Pile: 5 Habits to Make Your Soldering Iron Tips Last Longer


Marc Ladle

Marc Ladle, Viking Test Ltd.

Marc’s columns deal with various aspects of PCB production, focusing especially on troubleshooting production problems.

Latest Column: Ladle on Manufacturing: LED UV Cure—Does It Really Work?


Yair Alcob

Yair Alcob, Orbotech

Orbotech shares its expert knowledge on how to maximize the value of manufacturing systems.

Latest Column: Language of Electronics: Key Considerations for Your Next Direct Imaging System


Sagi Reuven

Sagi Reuven, Siemens Digital Industries

Sagi Reuven offers PCBA manufactures advice on Lean manufacturing with a focus on ROI and customers' stories.

 

Latest Column: Lean Digital Thread: Micro-Solutions—Solving One Challenge at a Time


John Coonrod

John Coonrod, Rogers Corporation

John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.

Latest Column: Lightning Speed Laminates: Why High-Frequency Materials Have Different Dk Values


Doug Sober

Doug Sober, Essex Technologies Group

Doug writes about the problems of & concerns with PCB laminate materials and their specifications.

 

Latest Column: Mr. Laminate Tells All: Is Your Laminate and Prepreg Supplier Cheating? Only One Way to Find Out


John Mitchell

John Mitchell, IPC--Association Connecting Electronics Industries

John will cover issues affecting the entire global electronics industry supply chain.

Latest Column: One World, One Industry: Navigating Around the Future


Alfred Macha

Alfred Macha, AMT Partners

Alfred will provide insight into topics, including process validation, operational excellence, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more.

Latest Column: Operational Excellence: Redefine Recruiting to Attract and Hire the Right Talent


Duane Benson

Duane Benson, Screaming Circuits

Duane offers tips and tricks for PCB assembly issues.

Latest Column: Powerful Prototypes: Small Computer Modules


Tom Kastner

Tom Kastner, GP Ventures, Ltd.

'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.

Latest Column: Punching Out! Dealing With Burnout


Eric Camden

Eric Camden, Foresite

Eric addresses PCBA reliability issues and how to prevent suspect conditions in the first place.

Latest Column: Quest for Reliability: What’s Lurking in the Shadows?


Istvan Novak

Istvan Novak, Samtec

Focusing on signal and power integrity issues related to PCB design and design engineering.

Latest Column: Quiet Power: Be Aware of Default Values in Circuit Simulators


Team Electrolube

Team Electrolube, Electrolube

Team Electrolube illustrates the best PCB design practices for optimizing the conformal coating process.

Latest Column: Sensible Design: Top Tips for a Successful Thermal Management Process


Michael Ford

Michael Ford, Aegis Software

Michael writes about the Industrial Internet of Manufacturing (IIoT), Industry 4.0 and smart factories, and how these technologies are accelerating the electronics manufacturing industry.

Latest Column: Smart Factory Insights: Changing Roles in the Digital Factory


Dr. Jennie Hwang

Dr. Jennie Hwang, H-Technologies Group

As an internationally recognized SMT authority, Dr. Hwang offers her perspective on a range of technical and process issues.

Latest Column: SMT Perspectives and Prospects: Joint Industry Standard IPC J-STD-00-Electronic Solder Alloys, Part 2


Ray Prasad

Ray Prasad, Ray Prasad Consulting

Ray writes about reducing costs - improving yields - and increasing reliability.

Latest Column: SMT Solver: How to Audit OEM-EMS Assembly Capability, Part 2


Greg Smith

Greg Smith, BlueRing Stencils

A discussion of the fundamental concepts and principles in SMT stencils including the latest developments and technologies.

Latest Column: SMT Stencils 101: Root-cause Stencil Design, Part 3—Tearing Down Bridges


Team ASC

Team ASC, American Standard Circuits

The experts behind this column strive to make all facets of printed circuit board technology clear and easy to understand.

Latest Column: Standard of Excellence: Bringing Your Salespeople Together


Todd Kolmodin

Todd Kolmodin, Gardien Services, USA

Todd covers a range of electrical test and reliability issues.

Latest Column: Testing Todd: Don’t Get Pickled by the Barrel


Mark Thompson

Mark Thompson, Monsoon Solutions Inc.

Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.

Latest Column: The Bare (Board) Truth: Via Basics


Mehul Davé

Mehul Davé, Entelechy Global and Linkage Technologies

Mehul's column explores benefits for outsourcing CAM engineering.

Latest Column: The Big Picture: Globalization—Imagine a United States That Isn't United


Kelly Dack

Kelly Dack, Printed Circuit Engineering Association

This column is dedicated to providing news about PCB design classes and events, as well as helping engineers, designers, and anyone related to printed circuit design from around the globe to network and share information.

Latest Column: The Digital Layout: PCEA and Industry Leaders Who Happen to Be Women


Chris Mitchell

Chris Mitchell, IPC

In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.

Latest Column: The Government Circuit: As 2021 Nears, What’s on IPC’s Government Policy Radar?


Chris Ellis

Chris Ellis, Manncorp Inc.

Chris will address common problems that Manncorp customers have had with the in-house conversion process and share solutions that have worked in the past.

Latest Column: The Mannifest: Solutions for Customer Support During Social Distancing


Team Elmatica

Team Elmatica, Elmatica

The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.

Latest Column: The PCB Norsemen: So Much More Than Just Through Vias


George Milad

George Milad, Uyemura International Corporation

George's columns cover PCB plating, IPC specifications, and more

Latest Column: The Plating Forum: Via Plating for PWBs


Martyn Gaudion

Martyn Gaudion, Polar Instruments

In his column, Martyn discusses signal integrity and impedance design test.

Latest Column: The Pulse: Application Notes—Advice for Authors


Steve Williams

Steve Williams, The Right Approach Consulting

A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.

Latest Column: The Right Approach: Simplify Your QMS Documentation Through KISS, Part 1


Tim Haag

Tim Haag, First Page Sage

Tim Haag discusses PCB design topics from his viewpoint as an EDA technologist and longtime board designer.

Latest Column: Tim’s Takeaways: PCB Vias, ‘You Have a Go’


Imran Valiani

Imran Valiani, RUSH PCB Inc.

Imran Valiani addresses ways to get products to market as quickly as possible.

Latest Column: Time to Market: You Get What You Pay For


Michael Carano

Michael Carano, RBP Chemical Technology

A comprehensive look at plating, metallization processes and PWB fabrication techniques.

Latest Column: Trouble in Your Tank: A Process Engineer’s Guide to Final Etching, Part 1


Bill Cardoso

Bill Cardoso, Creative Electron

Dr. Cardoso will cover everything related to X-rays from cool historical facts to the latest in technological advancements.

Latest Column: X-Rayted Files: iPhone Transparency—A Window Into SMT


Zulki Khan

Zulki Khan, NexLogic Technologies, Inc.

Zulki Khan talks about new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

Latest Column: Zulki’s PCB Nuggets: Consider Low-Temp Solder for PCB Microelectronics Assembly


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