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Redwire Announces Development of New European-Built Very Low Earth Orbit (VLEO) Spacecraft Platform called Phantom

05/13/2024 | BUSINESS WIRE
Redwire Corporation, a leader in space infrastructure for the next generation space economy, announced Phantom, a new European Very Low Earth Orbit (VLEO) spacecraft platform.

NEOTech Positions Itself as Microelectronics Industry Leader with High-Technology Investments

05/09/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, announces a significant investment in acquiring new Palomar 8100 wire bonder machines, enhancing the company’s positioning as a leader of cutting-edge microelectronics assemblies for mission-critical applications.

Record Numbers of Exhibitors to Showcase Products and Services at EWPTE 2024

04/25/2024 | IPC
WHMA/IPC announces that 215 exhibitors spanning over 50,000 nsf of exhibit space will introduce new product technologies, innovations and demonstrations of the electrical wire harness, wire, coil winding and cable processing industries’ newest advancements at Electrical Wire Processing Technology Expo (EWPTE) to be held at Baird Center May 14-16, 2024, in Milwaukee, Wis. This marks the largest number of exhibiting companies in the event’s history. More than 3,000 attendees are expected to attend this year’s event. 

The Connection Between Wire Harness and Box Build

04/17/2024 | Nolan Johnson, I-Connect007
Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.

DOCOMO, NTT, NEC and Fujitsu Develop Top-level Sub-terahertz 6G Device

04/12/2024 | JCN Newswire
NTT DOCOMO, INC., NTT Corporation, NEC Corporation and Fujitsu Limited jointly announced today the development of a top-level (1) wireless device capable of ultra-high-speed 100 Gbps transmissions in the 100 GHz and 300 GHz sub-terahertz bands.
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