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Merlin Flex invests in New Schmoll Direct Imaging System

04/30/2024 | Merlin Flex Ltd
Merlin Flex has fully installed and commissioned its 2nd Schmoll MDI Direct Imaging system. This new machine includes a twin bed, 4 head system which enhances Merlin Flex’s direct imaging capability for its 1.4M long flexible circuits.

Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications

04/30/2024 | Indium Corporation
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.

TTM’s High Tech Expansion and Industry Innovation

04/30/2024 | Marcy LaRont, PCB007 Magazine
Tom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.

Scanfil Uses Employee Engagement Survey to Improve

04/30/2024 | Scanfil
Once a year Scanfil arranges Employee Engagement Survey (EES) in order to get valuable insight from its employees. In EES all employees are invited to share their opinion, bring ideas for improvements, and contribute to making Scanfil a better place to work.

Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND

04/29/2024 | Samsung Electronics
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
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