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Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

04/17/2024 | Micron
Micron Technology, Inc. announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services.

On the Line With... Podcast Talks With Cadence Expert on Manufacturing

04/18/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.

Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense

04/16/2024 | ANSYS
Ansys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).

Aegis Software and JUKI Extend Reseller Relationship, Marking Over 23 Years of Collaboration

04/11/2024 | Aegis Software
Aegis Software, a global provider of Manufacturing Execution System (MES) software, announces that JUKI Automation, a world-leading provider of automated assembly products and systems and subsidiary of JUKI Corporation, has renewed their reseller relationship with Aegis Software.

Now Available: Episode 4, Season 2 of Designing for Reality—Lamination

04/04/2024 | I-Connect007
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
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